BGA Components

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits.

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Systech Illinois develop gas analysis system for measuring trace gas impurities

In response to customer demand, Systech Illinois have developed a new cylinder analysis system. More

Positive response to our participation at Ipack Ima 2012

The features and benefits of our gas analysers for the packaging industry were demonstrated to the daily influx of visitors to our stand. More

Systech Illinois

Our manufacturing plants produce gas analyzers for the process industries, including intrinsically safe oxygen analyzers for hazardous areas. For the food and pharmaceutical industry; we produce headspace gas analyzers for gas flushing of food and headspace analysis and for the packaging industry; oxygen and water vapor permeation analyzers.

BGA Components

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